UL94 Rating
Independent laboratories perform UL testing across the U.S. UL = Underwriters Laboratory, 94 = test method, V = vertical, - number = rating. San Francisco Bay area UL office number: (408) 985-2400
The higher the number rating the more likely the substance is to burn. UL94V-0 is least likely to burn.
Our mold compounds and BT Substrates (modules) are UL94V-0 rated for the following packages:
| SOT23 (S3, S5, S6, TS8) | SOT223 (ST) | TO-92 (Z) |
| SC70 (SC6) | TO-220 (T, T7) | DDPAK (M,Q,R) |
| PDIP (N, NW) | MSOP (MS8/E, MS/E) | SOIC (S8, S, SW) |
| SSOP (GN, G, GW) | TSSOP (F, FW, FE) | QFN/DFN (UXX/DXX) |
| LTM Modules (V, Y) |
Check with Package Engineering for other package types.
Oxygen Index
Standard testing methods have been developed in America and Japan. Test methods are equivalent.
Methods: American National Standard, ANSI / ASTM D2863 -77
Japanese Industrial Standard, JIS K7201
Definition from ASTM: oxygen index - the minimum concentration of oxygen, expressed as volume percent, in a mixture of oxygen and nitrogen that will just support flaming combustion of a material initially at room temperature under the conditions of this method.
Our mold compounds are rated to pass oxygen index of 28% minimum.
Check with Package Engineering if any questions.
Package Engineering /20-June-2003