Independent laboratories perform UL testing across the U.S. UL = Underwriters Laboratory, 94 = test method, V = vertical, - number = rating. San Francisco Bay area UL office number: (408) 985-2400
The higher the number rating the more likely the substance is to burn. UL94V-0 is least likely to burn.
Our mold compounds and BT Substrates (modules) are UL94V-0 rated for the following packages:
|SOT23 (S3, S5, S6, TS8)||SOT223 (ST)||TO-92 (Z)|
|SC70 (SC6)||TO-220 (T, T7)||DDPAK (M,Q,R)|
|PDIP (N, NW)||MSOP (MS8/E, MS/E)||SOIC (S8, S, SW)|
|SSOP (GN, G, GW)||TSSOP (F, FW, FE)||QFN/DFN (UXX/DXX)|
|LTM Modules (V, Y)|
Check with Package Engineering for other package types.
Standard testing methods have been developed in America and Japan. Test methods are equivalent.
Methods: American National Standard, ANSI / ASTM D2863 -77
Japanese Industrial Standard, JIS K7201
Definition from ASTM: oxygen index - the minimum concentration of oxygen, expressed as volume percent, in a mixture of oxygen and nitrogen that will just support flaming combustion of a material initially at room temperature under the conditions of this method.
Our mold compounds are rated to pass oxygen index of 28% minimum.
Check with Package Engineering if any questions.
Package Engineering /20-June-2003