μModule Design and Manufacturing Resources

A µModule power product simplifies implementation, Verification, and Manufacturing of complex power circuits by integrating the power function in a compact molded plastic package. Below is a list of guides for product selection, design, evaluation, simulation, layout, PCB assembly, and packaging.

 

 Design Resources

 Manufacturing Resources

 

Design Resources

Selector Guides

 

Free Simulation Tools

  • Download LTspice IV, our powerful, free schematic capture and simulation program for models and demo circuits of DC/DC μModule products
  • LTpowerCAD is an alternative DC/DC μModule product selection tool. The tool also assists you through the external component selection process and confirms stability for your unique application. Once complete, the design is easily exportable to LTspice for simulation.
  • LTpowerPlay is a powerful, Windows-based development environment supporting Linear Technology's Digital Power System Management (PSM) products.

 

Demo Boards, Software, & Gerber Files

Demo boards, gerber files, manual, and associated software are available for all products. Visit the demo board page or visit the appropriate product page.

Symbols and Footprints

 

FPGA Reference Designs

 

Electrical Performance

For other design information and applications information, please refer to the product datasheets or the following documents:

 

Thermal Performance

 

EMC Test Reports

 

Manufacturing Resources

Quick Start Guide

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages

 

PCB Assembly and Manufacturing Guidelines

LGA Packages: Assembly Considerations for Linear Technology µModule LGA Packages
BGA Packages: Assembly Considerations for Linear Technology µModule BGA Packages

Provides a complete guide to:

  • Package Construction
  • PCB Design Guidelines
  • Moisture Sensitivity, Pack, Ship & Bake
  • Board Assembly Process
    • Screen Print
    • Stencil Design
    • Solder Paste, Key Process Parameters
    • Placement
    • Reflow Profile
    • Cleaning
    • Removal and Rework

 

Shipping Quantities & Tray Dimensions

 

Materials Declarations & RoHS

For complete materials declarations information for specific products, please click here to download materials declarations for all µModule solution part numbers.

For general information on our RoHS program, please visit our Lead Free Program and RoHS Compliance page.

 

Package & Board Level Reliability

Data reports from ongoing reliability test are updated regularly and may be accessed from the following links.

 

Moisture Sensitivity

For moisture sensitivity of µModule devices, please click here or see page 2 of datasheet.