μModule Design and Manufacturing Resources

Beyond providing a complete system-in-package (SIP) solution, Linear Technology provides a free comprehensive suite of design and manufacturing tools and information for µModule Products to help get your design to market quickly and reliably the first time.  See the table below to obtain free circuit simulation tools, design & application notes, reference PCB gerber design files which you can copy into your PCB layout, PCB assembly guidelines, materials declaration, RoHS compliance information and more.

 Design Resources

 Manufacturing Resources

 

Selector Guides

For datasheets and complete product information regarding a specific product, simply type the part number into the search box at the top right corner of this page.

Demo Boards, Software, & Gerber Files

Demo boards, gerber files, manual, and associated software are available for all products. Visit the demo board page or visit the appropriate product page.

 

Electrical Performance

For other design information and applications information, please refer to the product datasheets or the following documents:

 

Thermal Performance

AN103 - LTM4600 DC/DC μModule Regulator Thermal Performance
AN110 - LTM4601 DC/DC μModule Regulator Thermal Performance

  • LGA Package Thermal Performance
  • Heat Sinking
  • Forced Airflow
  • Current Derating

AN119B - Powering Complex FPGA-Based Systems Using Highly Integrated DC/DC µModule Regulator Systems
Thermal Performance and Layout

 

Free Simulation Tools

Download LTspice IV, our powerful, free schematic capture and simulation program for models and demo circuits of DC/DC μModule products

LTpowerCAD is an alternative DC/DC μModule product selection tool. The tool also assists you through the external component selection process and confirms stability for your unique application. Once complete, the design is easily exportable to LTspice for simulation.

 

Quick Start Guide

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages

 

PCB Assembly and Manufacturing Guidelines

LGA Packages: Assembly Considerations for Linear Technology µModule LGA Packages
BGA Packages: Assembly Considerations for Linear Technology µModule BGA Packages

Provides a complete guide to:

  • Package Construction
  • PCB Design Guidelines
  • Moisture Sensitivity, Pack, Ship & Bake
  • Board Assembly Process
    • Screen Print
    • Stencil Design
    • Solder Paste, Key Process Parameters
    • Placement
    • Reflow Profile
    • Cleaning
    • Removal and Rework

 

Shipping Quantities & Tray Dimensions

 

Materials Declarations & RoHS

For complete materials declarations information for specific products, please click here to download materials declarations for all µModule solution part numbers.

For general information on our RoHS program, please visit our Lead Free Program and RoHS Compliance page.

 

Package & Board Level Reliability

Data reports from ongoing reliability test are updated regularly and may be accessed from the following links.

LTM28xx familyLTM46xx familyLTM80xx familyLTM90xx family

LGA Board Level Reliability

BGA Board Level Reliability

 

 

Moisture Sensitivity

For moisture sensitivity of umodule devices, please click here.