μModule Packaging, Assembly and Thermal Performance

The Linear Technology μModule™ solution combines integrated circuits and passive components in a single package. The μModule integrates several technologies to deliver a cost effective, advanced solution which maximizes board space and improves electrical and thermal performance.

The μModule is overmolded in a solid array and individual units are saw singulated. All μModule components are leadless with electrical connections being made through the land pad array.

Selector Guides
Packaging Information
PCB Assembly and Manufacturing Guidelines
Thermal Performance
Electrical Performance
LTspice/SwitcherCAD Models and Demo Circuits
Materials Declarations and RoHS
Demo Boards
Reliability

Selector Guides

For a sortable selection table of μModule products, please visit:

For datasheets and complete product information regarding a specific product, simply type the part number into the search box at the top of this page.

Package Information

Products in the μModule family are packaged in a Land Grid Array (LGA) package. For package dimensions and shipping information, please refer to:

PCB Assembly and Manufacturing Guidelines

Video App Note AN116 – Assembly Considerations for Linear Technology μModule LGA Packages (Video Presentation Training - requires Internet Explorer. The program will load and start quickly; however, please wait 1 - 2 minutes for all features to load as you are watching the presentation):

Construction
Stencil Design
Solder Paste
Placement
Reflow Profile
Rework
Reliability

AN100 – Recommended Land Pad and Assembly and Rework Guidelines provides a complete guide to:

PCB Design Guidelines for LGA Packages
Land Pad Design
Solder Paste Screen Printing Process
Package to Board Assembly Process
Rework

AN114 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for uModule Family of Products provides information on:

Thermal benefits of LGA package
LGA pad construction
Reflow and interconnect integrity for LGA package

Thermal Performance

AN103 – LTM4600 DC/DC μModule Thermal Performance and
AN110 – LTM4601 DC/DC μModule Thermal Performance provide a complete reference on:

LGA Package Thermal Performance
Heat Sinking
Forced Airflow
Current Derating

Electrical Performance

For other design information and applications information, please refer to the product datasheets or the following documents:

LTspice/SwitcherCAD Models

Download LTspice/SwitcherCAD, our powerful, free schematic capture and simulation program for models and demo circuits of all μModule products

For ready to run LTspice demonstration circuits, please refer to the product page by typing in the part number in the search box at the top of this page.

Materials Declarations & RoHS

The LGA package uses a gold finish and is RoHS 6 of 6 compliant. For complete materials declarations information for specific products, please visit our Materials Declarations page or click here to download materials declarations for all module products here.

For general information on our RoHS program, please visit our Lead Free Program and RoHS Compliance page.

Demo Boards

For demo board information and layout files for μModule products, simply type the part number in the search box at the top of this page and click the Order Info tab at the top of the page.

Reliability

μModules offer IC level reliability for complete system solutions. For up to date reliability information, simply type the part number in the search box at the top of this page and look for “Reliability Data” under the “Documentation” column at the right side of the product page.