LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC7851IUHH-1#TRPBF | (Engineering Calculation) | QFN 5mm X 9mm Exp. Pad | ||||||
| (printed on: 2017-03-16 19:10:36) | TOTAL MASS (g): | 0.116295 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003616 | 1000000 | 31093.4023438 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.049823 | 975000 | 428419.9375 | ||
| Iron (Fe) | 7439-89-6 | 0.001226 | 24000 | 10542.1767578 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000015 | 300 | 128.982574463 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000036 | 700 | 309.558197021 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.051100 | 1000000 | 439400.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002793 | 1000000 | 24014.5371094 | ||||
| External Plating Total: | 0.002793 | 1000000 | 24014.5371094 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000138 | 1000000 | 1186.63977051 | ||||
| Internal Plating Total: | 0.000138 | 1000000 | 1186.63977051 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000015 | 50000 | 128.982574463 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000092 | 300000 | 791.093200684 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000200 | 650000 | 1719.7677002 | |||||
| Die Attach Total: | 0.000307 | 1000000 | 2639.84350586 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.007554 | 130000 | 64955.6289062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.049975 | 860000 | 429727 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000581 | 10000 | 4995.92529297 | ||||
| Encapsulation Total: | 0.058110 | 1000000 | 499678.53125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000231 | 1000000 | 1986.33178711 | ||
| TOTAL MASS (g): | 0.116295 | |||||||