LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC6930HDCB-8.19#TRPBF | (Engineering Calculation) | DFN 2mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-16 17:49:36) | TOTAL MASS (g): | 0.015162 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000667 | 1000000 | 43990.5625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.005723 | 975000 | 377448.25 | ||
| Iron (Fe) | 7439-89-6 | 0.000141 | 24000 | 9299.35351562 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000002 | 300 | 131.905731201 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 700 | 263.811462402 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.005870 | 1000000 | 387143.3125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000260 | 1000000 | 17170.3339844 | ||||
| External Plating Total: | 0.000260 | 1000000 | 17170.3339844 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000136 | 1000000 | 8969.58984375 | ||||
| Internal Plating Total: | 0.000136 | 1000000 | 8969.58984375 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000440 | 750000 | 29019.2617188 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000147 | 250000 | 9695.07128906 | |||||
| Die Attach Total: | 0.000587 | 1000000 | 38714.3320312 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000989 | 130000 | 65227.3828125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006545 | 860000 | 431661.5 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000076 | 10000 | 5012.41748047 | ||||
| Encapsulation Total: | 0.007610 | 1000000 | 501901.34375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 2110.49169922 | ||
| TOTAL MASS (g): | 0.015162 | |||||||