LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC6912HGN-2#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 02:36:27) | TOTAL MASS (g): | 0.081535 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002756 | 1000000 | 33801.40625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.029933 | 975000 | 367118.09375 | ||
| Iron (Fe) | 7439-89-6 | 0.000737 | 24000 | 9039.05566406 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 110.381950378 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 257.557861328 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.030700 | 1000000 | 376525.09375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002272 | 1000000 | 27866.2929688 | ||||
| External Plating Total: | 0.002272 | 1000000 | 27866.2929688 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000246 | 1000000 | 3017.10668945 | ||||
| Internal Plating Total: | 0.000246 | 1000000 | 3017.10668945 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000865 | 750000 | 10608.9316406 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000288 | 250000 | 3532.22241211 | |||||
| Die Attach Total: | 0.001153 | 1000000 | 14141.1542969 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006623 | 150000 | 81228.84375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036203 | 820000 | 444017.53125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001104 | 25000 | 13540.1855469 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000221 | 5000 | 2710.48999023 | ||||
| Encapsulation Total: | 0.044151 | 1000000 | 541497.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000257 | 1000000 | 3152.01806641 | ||
| TOTAL MASS (g): | 0.081535 | |||||||