LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC6702HDC#TRMPBF | (Engineering Calculation) | DFN 2mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-16 20:52:11) | TOTAL MASS (g): | 0.009308 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000396 | 1000000 | 42542.5625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.002935 | 975000 | 315309.125 | ||
| Iron (Fe) | 7439-89-6 | 0.000072 | 24000 | 7735.01171875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 107.430717468 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000002 | 700 | 214.861434937 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.003010 | 1000000 | 323366.46875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000136 | 1000000 | 14645.4707031 | ||||
| External Plating Total: | 0.000136 | 1000000 | 14645.4707031 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000072 | 1000000 | 7735.01171875 | ||||
| Internal Plating Total: | 0.000072 | 1000000 | 7735.01171875 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000339 | 750000 | 36419.0117188 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000113 | 250000 | 12139.6708984 | |||||
| Die Attach Total: | 0.000452 | 1000000 | 48558.6835938 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000677 | 130000 | 72730.5859375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.004481 | 860000 | 481397 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000052 | 10000 | 5586.39697266 | ||||
| Encapsulation Total: | 0.005210 | 1000000 | 559714 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 3437.78295898 | ||
| TOTAL MASS (g): | 0.009308 | |||||||