LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC6409IUDB#PBF (Engineering Calculation) QFN 3mm X 2mm Exp. Pad  
(printed on: 2017-03-16 22:12:58) TOTAL MASS (g): 0.014786
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000976 1000000 66010.140625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.005090 975000 344253.71875
Iron (Fe) 7439-89-6 0.000125 24000 8454.16796875
Phosphorus (P) 7723-14-0 0.000002 300 135.266693115
Zinc (Zn) 7440-66-6 0.000004 700 270.53338623
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.005221 1000000 353113.6875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000185 1000000 12485.5546875
External Plating Total: 0.000185 1000000 12485.5546875
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000103 1000000 6966.234375
Internal Plating Total: 0.000103 1000000 6966.234375
Die Attach SnAg Cap Silver (Ag) 7440-22-4 0.000019 20000 1285.03344727
Tin (Sn) 7440-31-5 0.000912 980000 61681.609375
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.000931 1000000 62966.6445312
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000958 130000 64792.7460938
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.006338 860000 428660.125
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000074 10000 5004.86767578
Encapsulation Total: 0.007370 1000000 498457.71875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000000 0 0
  TOTAL MASS (g): 0.014786