LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC6090HS8E-5#TRPBF | (Engineering Calculation) | SOIC Exposed Pad | ||||||
| (printed on: 2017-03-16 23:49:39) | TOTAL MASS (g): | 0.074928 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002750 | 1000000 | 36701.9492188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023398 | 964450 | 312273.53125 | ||
| Iron (Fe) | 7439-89-6 | 0.000547 | 22560 | 7300.35058594 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 240 | 80.0769805908 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000030 | 1250 | 400.384857178 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000279 | 11500 | 3723.5793457 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024260 | 1000000 | 323777.90625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001920 | 1000000 | 25623.4003906 | ||||
| External Plating Total: | 0.001920 | 1000000 | 25623.4003906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000300 | 1000000 | 4003.84887695 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000000 | 0 | 0 | ||||
| Internal Plating Total: | 0.000300 | 1000000 | 4003.84887695 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000850 | 750000 | 11344.2382812 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000283 | 250000 | 3776.96411133 | |||||
| Die Attach Total: | 0.001133 | 1000000 | 15121.203125 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004571 | 103000 | 61005.3125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.039720 | 895000 | 530109.5625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000089 | 2000 | 1187.80847168 | ||||
| Encapsulation Total: | 0.044380 | 1000000 | 592302.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000185 | 1000000 | 2469.04003906 | ||
| TOTAL MASS (g): | 0.074928 | |||||||