LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC5549IUDB#TRMPBF | (Engineering Calculation) | QFN 3mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-16 19:22:02) | TOTAL MASS (g): | 0.015483 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001424 | 1000000 | 91974.1796875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.005090 | 975000 | 328756.03125 | ||
| Iron (Fe) | 7439-89-6 | 0.000125 | 24000 | 8073.57666016 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000002 | 300 | 129.177215576 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 700 | 258.354431152 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.005221 | 1000000 | 337217.125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000185 | 1000000 | 11923.4775391 | ||||
| External Plating Total: | 0.000185 | 1000000 | 11923.4775391 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1000000 | 6652.62646484 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 6652.62646484 | |||||
| Die Attach | SnAg Cap | Silver (Ag) | 7440-22-4 | 0.000024 | 20000 | 1550.12670898 | ||
| Tin (Sn) | 7440-31-5 | 0.001156 | 980000 | 74664.4296875 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001180 | 1000000 | 76214.5625 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000958 | 130000 | 61875.8867188 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006338 | 860000 | 409362.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000074 | 10000 | 4779.55712891 | ||||
| Encapsulation Total: | 0.007370 | 1000000 | 476018.03125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000000 | 0 | 0 | ||
| TOTAL MASS (g): | 0.015483 | |||||||