LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC4441ES8-1#TRPBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 02:40:31) | TOTAL MASS (g): | 0.072822 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001705 | 1000000 | 23413.3027344 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023653 | 975000 | 324806.375 | ||
| Iron (Fe) | 7439-89-6 | 0.000582 | 24000 | 7992.10742188 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 96.125 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 233.446426392 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024259 | 1000000 | 333128.03125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001477 | 1000000 | 20280.3417969 | ||||
| External Plating Total: | 0.001477 | 1000000 | 20280.3417969 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000068 | 1000000 | 933.785705566 | ||||
| Internal Plating Total: | 0.000068 | 1000000 | 933.785705566 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000617 | 750000 | 8472.73144531 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000206 | 250000 | 2828.82128906 | |||||
| Die Attach Total: | 0.000823 | 1000000 | 11301.5527344 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006657 | 150000 | 91414.875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036392 | 820000 | 499740.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001110 | 25000 | 15242.6767578 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000222 | 5000 | 3048.53564453 | ||||
| Encapsulation Total: | 0.044381 | 1000000 | 609446.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000109 | 1000000 | 1496.80358887 | ||
| TOTAL MASS (g): | 0.072822 | |||||||