LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4419IMSE#TRPBF | (Engineering Calculation) | MSOP-Exposed | ||||||
| (printed on: 2017-03-16 22:36:06) | TOTAL MASS (g): | 0.037291 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003189 | 1000000 | 85516.5546875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013845 | 975000 | 371269 | ||
| Iron (Fe) | 7439-89-6 | 0.000341 | 24000 | 9144.29199219 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 107.264411926 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 700 | 268.16104126 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.014200 | 1000000 | 380788.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 19040.1035156 | ||||
| External Plating Total: | 0.000710 | 1000000 | 19040.1035156 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 2306.18505859 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 2306.18505859 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000011 | 50000 | 294.977172852 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000063 | 300000 | 1689.41455078 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000137 | 650000 | 3673.80639648 | |||||
| Die Attach Total: | 0.000211 | 1000000 | 5658.19824219 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002439 | 130000 | 65404.4765625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015571 | 830000 | 417553.5625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000657 | 35000 | 17618.1816406 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000094 | 5000 | 2520.71386719 | ||||
| Encapsulation Total: | 0.018761 | 1000000 | 503096.9375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000134 | 1000000 | 3593.35791016 | ||
| TOTAL MASS (g): | 0.037291 | |||||||