LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4402-2EMS#PBF | (Engineering Calculation) | MSOP | ||||||
| (printed on: 2017-03-17 01:07:51) | TOTAL MASS (g): | 0.026225 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001193 | 1000000 | 45490.8984375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.010433 | 975000 | 397826.0625 | ||
| Iron (Fe) | 7439-89-6 | 0.000257 | 24000 | 9799.79980469 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 114.394546509 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 266.920593262 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.010700 | 1000000 | 408007.21875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 27074.328125 | ||||
| External Plating Total: | 0.000710 | 1000000 | 27074.328125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 3279.31030273 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 3279.31030273 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000497 | 750000 | 18951.3632812 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000166 | 250000 | 6329.83105469 | |||||
| Die Attach Total: | 0.000663 | 1000000 | 25281.1953125 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001659 | 130000 | 63260.1835938 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.010591 | 830000 | 403850.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000447 | 35000 | 17044.7871094 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000064 | 5000 | 2440.41699219 | ||||
| Encapsulation Total: | 0.012761 | 1000000 | 486596.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000112 | 1000000 | 4270.72949219 | ||
| TOTAL MASS (g): | 0.026225 | |||||||