LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4364IS-2#TRPBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 21:48:58) | TOTAL MASS (g): | 0.154902 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002532 | 1000000 | 16345.8515625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.051070 | 975000 | 329692.96875 | ||
| Iron (Fe) | 7439-89-6 | 0.001257 | 24000 | 8114.82421875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000016 | 300 | 103.291313171 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000037 | 700 | 238.861175537 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.052380 | 1000000 | 338149.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002954 | 1000000 | 19068.2480469 | ||||
| External Plating Total: | 0.002954 | 1000000 | 19068.2480469 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000419 | 1000000 | 2704.94116211 | ||||
| Internal Plating Total: | 0.000419 | 1000000 | 2704.94116211 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000808 | 750000 | 5216.2109375 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000269 | 250000 | 1736.58532715 | |||||
| Die Attach Total: | 0.001077 | 1000000 | 6952.796875 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb Free | Resin (EP) | 0.009816 | 103000 | 63369.2226562 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085294 | 895000 | 550633.0625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 1233.04003906 | ||||
| Encapsulation Total: | 0.095301 | 1000000 | 615235.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000239 | 1000000 | 1542.91394043 | ||
| TOTAL MASS (g): | 0.154902 | |||||||