LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4358CFE#TRPBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 03:18:01) | TOTAL MASS (g): | 0.056119 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001279 | 1000000 | 22790.7890625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.018525 | 975000 | 330101.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000456 | 24000 | 8125.56787109 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 106.915367126 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000013 | 700 | 231.64994812 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.019000 | 1000000 | 338565.28125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002537 | 1000000 | 45210.1523438 | ||||
| External Plating Total: | 0.002537 | 1000000 | 45210.1523438 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000250 | 1000000 | 4454.80712891 | ||||
| Internal Plating Total: | 0.000250 | 1000000 | 4454.80712891 | |||||
| Die Attach | HYBRID | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000006 | 50000 | 106.915367126 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000034 | 300000 | 605.85369873 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000075 | 650000 | 1336.4420166 | |||||
| Die Attach Total: | 0.000115 | 1000000 | 2049.21118164 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004388 | 135000 | 78190.765625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.027950 | 860000 | 498047.375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000163 | 5000 | 2904.53393555 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 579142.6875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000437 | 1000000 | 7787.00244141 | ||
| TOTAL MASS (g): | 0.056119 | |||||||