LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4355IS#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 21:42:45) | TOTAL MASS (g): | 0.155486 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002979 | 1000000 | 19159.3183594 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.051070 | 975000 | 328454.65625 | ||
| Iron (Fe) | 7439-89-6 | 0.001257 | 24000 | 8084.34472656 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000016 | 300 | 102.90335083 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000037 | 700 | 237.964004517 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.052380 | 1000000 | 336879.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002954 | 1000000 | 18996.6289062 | ||||
| External Plating Total: | 0.002954 | 1000000 | 18996.6289062 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000419 | 1000000 | 2694.78149414 | ||||
| Internal Plating Total: | 0.000419 | 1000000 | 2694.78149414 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000911 | 750000 | 5859.05957031 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000304 | 250000 | 1955.16369629 | |||||
| Die Attach Total: | 0.001215 | 1000000 | 7814.22412109 | |||||
| Encapsulation | DCPD RESIN | Resin (EP) | 0.010483 | 110000 | 67420.9921875 | |||
| Bromine (Br) | 40039-93-8 | 0.000953 | 10000 | 6129.18066406 | ||||
| Silica (SiO2) | 60676-86-0 | 0.081005 | 850000 | 520980.34375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.002859 | 30000 | 18387.5410156 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.095300 | 1000000 | 612918.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000239 | 1000000 | 1537.11877441 | ||
| TOTAL MASS (g): | 0.155486 | |||||||