LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC4355CDE#PBF | (Engineering Calculation) | DFN 4mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 21:42:48) | TOTAL MASS (g): | 0.032084 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001986 | 1000000 | 61900.4609375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013133 | 975000 | 409334.6875 | ||
| Iron (Fe) | 7439-89-6 | 0.000323 | 24000 | 10067.3955078 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 124.67363739 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000009 | 700 | 280.515686035 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.013469 | 1000000 | 419807.3125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000626 | 1000000 | 19504.2148438 | ||||
| External Plating Total: | 0.000626 | 1000000 | 19504.2148438 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000302 | 1000000 | 9412.859375 | ||||
| Internal Plating Total: | 0.000302 | 1000000 | 9412.859375 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000911 | 750000 | 28394.4199219 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000304 | 250000 | 9475.1953125 | |||||
| Die Attach Total: | 0.001215 | 1000000 | 37869.6171875 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.001587 | 110000 | 49464.2617188 | |||
| Bromine (Br) | 40039-93-8 | 0.000144 | 10000 | 4488.25097656 | ||||
| Silica (SiO2) | 60676-86-0 | 0.012266 | 850000 | 382311.6875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000433 | 30000 | 13495.9208984 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.014430 | 1000000 | 449760.125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000056 | 1000000 | 1745.4309082 | ||
| TOTAL MASS (g): | 0.032084 | |||||||