LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4305IDHD#PBF | (Engineering Calculation) | DFN 5mm X 4mm Exp. Pad | ||||||
| (printed on: 2017-03-17 02:11:22) | TOTAL MASS (g): | 0.053631 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002701 | 1000000 | 50362.9140625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023117 | 975000 | 431040.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.000569 | 24000 | 10609.5888672 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 130.522186279 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 316.982452393 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.023710 | 1000000 | 442097.25 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001124 | 1000000 | 20953.1523438 | ||||
| External Plating Total: | 0.001124 | 1000000 | 20953.1523438 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000522 | 1000000 | 9733.22558594 | ||||
| Internal Plating Total: | 0.000522 | 1000000 | 9733.22558594 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001115 | 750000 | 20790.3183594 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000372 | 250000 | 6936.32128906 | |||||
| Die Attach Total: | 0.001487 | 1000000 | 27726.640625 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.002638 | 110000 | 49188.2148438 | |||
| Bromine (Br) | 40039-93-8 | 0.000240 | 10000 | 4475.04589844 | ||||
| Silica (SiO2) | 60676-86-0 | 0.020383 | 850000 | 380061.96875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000719 | 30000 | 13406.4931641 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.023980 | 1000000 | 447131.65625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000107 | 1000000 | 1995.12463379 | ||
| TOTAL MASS (g): | 0.053631 | |||||||