LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4270CIUKG#TRPBF | (Engineering Calculation) | QFN 7mm X 8mm Exposed Pad | ||||||
| (printed on: 2017-03-16 21:41:55) | TOTAL MASS (g): | 0.162221 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007993 | 1000000 | 49272.1875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.076937 | 975000 | 474271.78125 | ||
| Iron (Fe) | 7439-89-6 | 0.001894 | 24000 | 11675.4072266 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000024 | 300 | 147.946029663 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000055 | 700 | 339.04296875 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.078910 | 1000000 | 486434.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003848 | 1000000 | 23722.7480469 | ||||
| External Plating Total: | 0.003848 | 1000000 | 23722.7480469 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001694 | 1000000 | 10442.5234375 | ||||
| Internal Plating Total: | 0.001694 | 1000000 | 10442.5234375 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000154 | 250000 | 949.320251465 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000154 | 250000 | 949.320251465 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000309 | 500000 | 1904.80493164 | |||||
| Die Attach Total: | 0.000617 | 1000000 | 3803.44555664 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.008945 | 130000 | 55140.71875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.059177 | 860000 | 364791.75 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000688 | 10000 | 4241.11914062 | ||||
| Encapsulation Total: | 0.068810 | 1000000 | 424173.59375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000349 | 1000000 | 2151.3815918 | ||
| TOTAL MASS (g): | 0.162221 | |||||||