LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4267IGN-1#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:39:01) | TOTAL MASS (g): | 0.078569 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000851 | 1000000 | 10831.2333984 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.029933 | 975000 | 380976.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.000737 | 24000 | 9380.28125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 114.54888916 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 267.280731201 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.030700 | 1000000 | 390738.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002272 | 1000000 | 28918.25 | ||||
| External Plating Total: | 0.002272 | 1000000 | 28918.25 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000246 | 1000000 | 3131.00292969 | ||||
| Internal Plating Total: | 0.000246 | 1000000 | 3131.00292969 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000005 | 50000 | 63.6382675171 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000027 | 300000 | 343.646636963 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000059 | 650000 | 750.93157959 | |||||
| Die Attach Total: | 0.000091 | 1000000 | 1158.21655273 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006623 | 150000 | 84295.25 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036203 | 820000 | 460779.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001104 | 25000 | 14051.3300781 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000221 | 5000 | 2812.81152344 | ||||
| Encapsulation Total: | 0.044151 | 1000000 | 561938.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000258 | 1000000 | 3283.734375 | ||
| TOTAL MASS (g): | 0.078569 | |||||||