LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4259ACGW-1#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:19:48) | TOTAL MASS (g): | 0.688458 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005421 | 1000000 | 7874.1171875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.192153 | 975000 | 279106.28125 | ||
| Iron (Fe) | 7439-89-6 | 0.004730 | 24000 | 6870.42529297 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000059 | 300 | 85.6987457275 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000138 | 700 | 200.447921753 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.197080 | 1000000 | 286262.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010584 | 1000000 | 15373.6367188 | ||||
| External Plating Total: | 0.010584 | 1000000 | 15373.6367188 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001577 | 1000000 | 2290.62573242 | ||||
| Internal Plating Total: | 0.001577 | 1000000 | 2290.62573242 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000175 | 440000 | 254.191192627 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000222 | 560000 | 322.459716797 | |||||
| Die Attach Total: | 0.000397 | 1000000 | 576.650878906 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.070896 | 150000 | 102977.9375 | |||
| Bromine (Br) | 40039-93-8 | 0.004726 | 10000 | 6864.61523438 | ||||
| Silica (SiO2) | 60676-86-0 | 0.382838 | 810000 | 556080.3125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.014179 | 30000 | 20595.296875 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.472639 | 1000000 | 686518.125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000760 | 1000000 | 1103.9161377 | ||
| TOTAL MASS (g): | 0.688458 | |||||||