LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC4241CGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-16 21:45:10) | TOTAL MASS (g): | 0.131851 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004766 | 1000000 | 36146.9609375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.040238 | 975000 | 305178.65625 | ||
| Iron (Fe) | 7439-89-6 | 0.000990 | 24000 | 7508.49511719 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000012 | 300 | 91.0120697021 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000029 | 700 | 219.945846558 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.041269 | 1000000 | 312998.09375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002831 | 1000000 | 21468.4804688 | ||||
| External Plating Total: | 0.002831 | 1000000 | 21468.4804688 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000330 | 1000000 | 2502.83178711 | ||||
| Internal Plating Total: | 0.000330 | 1000000 | 2502.83178711 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001269 | 750000 | 9624.52636719 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000423 | 250000 | 3208.17529297 | |||||
| Die Attach Total: | 0.001692 | 1000000 | 12832.7011719 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb Free | Resin (EP) | 0.008259 | 103000 | 62639.0585938 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.071761 | 895000 | 544259.75 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000160 | 2000 | 1213.4942627 | ||||
| Encapsulation Total: | 0.080180 | 1000000 | 608112.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000783 | 1000000 | 5938.53808594 | ||
| TOTAL MASS (g): | 0.131851 | |||||||