LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC4233CWHH#TRPBF | (Engineering Calculation) | QFN MultiPad 5 X 9 X 0.9mm | ||||||
| (printed on: 2017-03-16 19:36:59) | TOTAL MASS (g): | 0.155644 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001573 | 1000000 | 10106.375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.076937 | 975000 | 494312.875 | ||
| Iron (Fe) | 7439-89-6 | 0.001894 | 24000 | 12168.7695312 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000024 | 300 | 154.197723389 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000055 | 700 | 353.369781494 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.078910 | 1000000 | 506989.25 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003848 | 1000000 | 24725.1894531 | ||||
| External Plating Total: | 0.003848 | 1000000 | 24725.1894531 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001694 | 1000000 | 10883.7890625 | ||||
| Internal Plating Total: | 0.001694 | 1000000 | 10883.7890625 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000009 | 50000 | 57.8241462708 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000051 | 300000 | 327.670135498 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000111 | 650000 | 713.164428711 | |||||
| Die Attach Total: | 0.000171 | 1000000 | 1098.65881348 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.008945 | 130000 | 57470.7773438 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.059177 | 860000 | 380206.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000688 | 10000 | 4420.33447266 | ||||
| Encapsulation Total: | 0.068810 | 1000000 | 442097.71875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000638 | 1000000 | 4099.08984375 | ||
| TOTAL MASS (g): | 0.155644 | |||||||