LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC4232CDHC#TRPBF | (Engineering Calculation) | DFN 5mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 03:26:39) | TOTAL MASS (g): | 0.037967 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001489 | 1000000 | 39218.2695312 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.017072 | 975000 | 449653.625 | ||
| Iron (Fe) | 7439-89-6 | 0.000420 | 24000 | 11062.2382812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000005 | 300 | 131.69329834 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000012 | 700 | 316.063964844 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.017509 | 1000000 | 461163.625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000817 | 1000000 | 21518.7421875 | ||||
| External Plating Total: | 0.000817 | 1000000 | 21518.7421875 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000391 | 1000000 | 10298.4169922 | ||||
| Internal Plating Total: | 0.000391 | 1000000 | 10298.4169922 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000008 | 50000 | 210.70930481 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000049 | 300000 | 1290.59448242 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000107 | 650000 | 2818.23681641 | |||||
| Die Attach Total: | 0.000164 | 1000000 | 4319.54052734 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002274 | 130000 | 59894.1210938 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015041 | 860000 | 396159.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000175 | 10000 | 4609.265625 | ||||
| Encapsulation Total: | 0.017490 | 1000000 | 460663.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000107 | 1000000 | 2818.23681641 | ||
| TOTAL MASS (g): | 0.037967 | |||||||