LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC4222IG#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 08:51:40) | TOTAL MASS (g): | 0.33482 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006599 | 1000000 | 19709.09375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.111592 | 962000 | 333289.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.003480 | 30000 | 10393.640625 | ||||
| Silicon (Si) | 7440-21-3 | 0.000754 | 6500 | 2251.95556641 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000174 | 1500 | 519.682067871 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.116000 | 1000000 | 346454.71875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010584 | 1000000 | 31611.3242188 | ||||
| External Plating Total: | 0.010584 | 1000000 | 31611.3242188 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000928 | 1000000 | 2771.63793945 | ||||
| Internal Plating Total: | 0.000928 | 1000000 | 2771.63793945 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001580 | 750000 | 4718.95214844 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000527 | 250000 | 1573.97961426 | |||||
| Die Attach Total: | 0.002107 | 1000000 | 6292.93164062 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.025785 | 135000 | 77011.5 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.164260 | 860000 | 490591.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000955 | 5000 | 2852.27807617 | ||||
| Encapsulation Total: | 0.191000 | 1000000 | 570455.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.007602 | 1000000 | 22704.7324219 | ||
| TOTAL MASS (g): | 0.334820 | |||||||