LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC4221CGN#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 08:50:51) | TOTAL MASS (g): | 0.084674 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005242 | 1000000 | 61907.9648438 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.029933 | 975000 | 353508.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.000737 | 24000 | 8703.96289062 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 106.289916992 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 248.009811401 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.030700 | 1000000 | 362566.71875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002272 | 1000000 | 26833.2441406 | ||||
| External Plating Total: | 0.002272 | 1000000 | 26833.2441406 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000246 | 1000000 | 2905.2578125 | ||||
| Internal Plating Total: | 0.000246 | 1000000 | 2905.2578125 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001354 | 750000 | 15990.7265625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000451 | 250000 | 5326.30566406 | |||||
| Die Attach Total: | 0.001805 | 1000000 | 21317.0332031 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006623 | 150000 | 78217.5625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036203 | 820000 | 427557.09375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001104 | 25000 | 13038.2294922 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000221 | 5000 | 2610.0078125 | ||||
| Encapsulation Total: | 0.044151 | 1000000 | 521422.875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000258 | 1000000 | 3046.97729492 | ||
| TOTAL MASS (g): | 0.084674 | |||||||