LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC4217HFE#TRPBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-16 19:33:46) | TOTAL MASS (g): | 0.07446 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002234 | 1000000 | 30002.4863281 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.026547 | 975000 | 356524.625 | ||
| Iron (Fe) | 7439-89-6 | 0.000653 | 24000 | 8769.75097656 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 107.43952179 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000019 | 700 | 255.16885376 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.027227 | 1000000 | 365656.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002940 | 1000000 | 39477.3515625 | ||||
| External Plating Total: | 0.002940 | 1000000 | 39477.3515625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001123 | 1000000 | 15081.8232422 | ||||
| Internal Plating Total: | 0.001123 | 1000000 | 15081.8232422 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000008 | 50000 | 107.43952179 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000049 | 300000 | 658.067016602 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000107 | 650000 | 1437.00354004 | |||||
| Die Attach Total: | 0.000164 | 1000000 | 2202.51025391 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006015 | 150000 | 80781.0859375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.032882 | 820000 | 441603.3125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001003 | 25000 | 13470.2285156 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000201 | 5000 | 2699.41796875 | ||||
| Encapsulation Total: | 0.040101 | 1000000 | 538554 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000672 | 1000000 | 9024.91894531 | ||
| TOTAL MASS (g): | 0.074460 | |||||||