LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC4007EGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-16 21:29:06) | TOTAL MASS (g): | 0.14543 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004110 | 1000000 | 28261.0996094 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.058949 | 975000 | 405343.90625 | ||
| Iron (Fe) | 7439-89-6 | 0.001451 | 24000 | 9977.3359375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000018 | 300 | 123.771224976 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000042 | 700 | 288.799530029 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.060460 | 1000000 | 415733.8125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003400 | 1000000 | 23376.2578125 | ||||
| External Plating Total: | 0.003400 | 1000000 | 23376.2578125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000484 | 1000000 | 3328.07080078 | ||||
| Internal Plating Total: | 0.000484 | 1000000 | 3328.07080078 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001139 | 750000 | 7831.96826172 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000380 | 250000 | 2612.94824219 | |||||
| Die Attach Total: | 0.001519 | 1000000 | 10444.9169922 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb Free | Resin (EP) | 0.007726 | 103000 | 53125.3632812 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.067134 | 895000 | 461625.4375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000150 | 2000 | 1031.42700195 | ||||
| Encapsulation Total: | 0.075010 | 1000000 | 515782.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000447 | 1000000 | 3073.65234375 | ||
| TOTAL MASS (g): | 0.145430 | |||||||