LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC4000IGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-16 21:20:33) | TOTAL MASS (g): | 0.170351 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003044 | 1000000 | 17868.9941406 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.064009 | 975000 | 375747.875 | ||
| Iron (Fe) | 7439-89-6 | 0.001576 | 24000 | 9251.49023438 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000020 | 300 | 117.404693604 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000046 | 700 | 270.030822754 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.065651 | 1000000 | 385386.75 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003749 | 1000000 | 22007.109375 | ||||
| External Plating Total: | 0.003749 | 1000000 | 22007.109375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000525 | 1000000 | 3081.87304688 | ||||
| Internal Plating Total: | 0.000525 | 1000000 | 3081.87304688 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000911 | 750000 | 5347.78369141 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000304 | 250000 | 1784.55126953 | |||||
| Die Attach Total: | 0.001215 | 1000000 | 7132.33544922 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.009848 | 103000 | 57810.0664062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085571 | 895000 | 502321.84375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 1121.21484375 | ||||
| Encapsulation Total: | 0.095610 | 1000000 | 561253.125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000557 | 1000000 | 3269.72070312 | ||
| TOTAL MASS (g): | 0.170351 | |||||||