LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3892EUH#TRPBF | (Engineering Calculation) | QFN 5mm X 5mm Exp. Pad | ||||||
| (printed on: 2017-03-16 19:11:10) | TOTAL MASS (g): | 0.065816 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003025 | 1000000 | 45961.28125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.028382 | 975000 | 431230.75 | ||
| Iron (Fe) | 7439-89-6 | 0.000699 | 24000 | 10620.4746094 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 136.74432373 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000020 | 700 | 303.876251221 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.029110 | 1000000 | 442291.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001398 | 1000000 | 21245.140625 | ||||
| External Plating Total: | 0.001398 | 1000000 | 21245.140625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000635 | 1000000 | 9648.0703125 | ||||
| Internal Plating Total: | 0.000635 | 1000000 | 9648.0703125 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001208 | 750000 | 18354.125 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000403 | 250000 | 6123.10644531 | |||||
| Die Attach Total: | 0.001611 | 1000000 | 24477.2324219 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.003888 | 130000 | 59073.5429688 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.025723 | 860000 | 390830.40625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000299 | 10000 | 4542.95019531 | ||||
| Encapsulation Total: | 0.029910 | 1000000 | 454446.90625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000127 | 1000000 | 1929.61425781 | ||
| TOTAL MASS (g): | 0.065816 | |||||||