LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3887IUJ#TRPBF | (Engineering Calculation) | QFN 6mm X 6mm Exp. Pad | ||||||
| (printed on: 2017-03-16 18:29:10) | TOTAL MASS (g): | 0.10302 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001985 | 1000000 | 19268.125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.043661 | 975000 | 423811.40625 | ||
| Iron (Fe) | 7439-89-6 | 0.001120 | 25000 | 10871.6884766 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000013 | 300 | 126.189231873 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000031 | 700 | 300.912811279 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.044825 | 1001000 | 435110.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.004194 | 1000000 | 40709.4375 | ||||
| External Plating Total: | 0.004194 | 1000000 | 40709.4375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000108 | 1000000 | 1048.34143066 | ||||
| Internal Plating Total: | 0.000108 | 1000000 | 1048.34143066 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000900 | 750000 | 8736.17871094 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000300 | 250000 | 2912.05932617 | |||||
| Die Attach Total: | 0.001200 | 1000000 | 11648.2373047 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006540 | 130000 | 63482.8945312 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.043267 | 860000 | 419986.90625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000503 | 10000 | 4882.55273438 | ||||
| Encapsulation Total: | 0.050310 | 1000000 | 488352.34375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000398 | 1000000 | 3863.33203125 | ||
| TOTAL MASS (g): | 0.103020 | |||||||