LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3882IUJ-1#TRPBF | (Engineering Calculation) | QFN 6mm X 6mm Exp. Pad | ||||||
| (printed on: 2017-03-16 22:28:18) | TOTAL MASS (g): | 0.103035 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002035 | 1000000 | 19750.59375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.043661 | 975000 | 423749.71875 | ||
| Iron (Fe) | 7439-89-6 | 0.001075 | 24000 | 10433.3613281 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000013 | 300 | 126.17086792 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000031 | 700 | 300.868988037 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.044780 | 1000000 | 434610.125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.004194 | 1000000 | 40703.5078125 | ||||
| External Plating Total: | 0.004194 | 1000000 | 40703.5078125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000108 | 1000000 | 1048.1887207 | ||||
| Internal Plating Total: | 0.000108 | 1000000 | 1048.1887207 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000915 | 750000 | 8880.48730469 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000305 | 250000 | 2960.16259766 | |||||
| Die Attach Total: | 0.001220 | 1000000 | 11840.6503906 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006540 | 130000 | 63473.6484375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.043267 | 860000 | 419925.78125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000503 | 10000 | 4881.84228516 | ||||
| Encapsulation Total: | 0.050310 | 1000000 | 488281.28125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000388 | 1000000 | 3765.71508789 | ||
| TOTAL MASS (g): | 0.103035 | |||||||