LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3834EFE#PBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 00:18:21) | TOTAL MASS (g): | 0.0733 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003843 | 1000000 | 52428.1367188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.024424 | 975000 | 333204.46875 | ||
| Iron (Fe) | 7439-89-6 | 0.000601 | 24000 | 8199.14453125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 109.140029907 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000018 | 700 | 245.565048218 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.025051 | 1000000 | 341758.34375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001770 | 1000000 | 24151.71875 | ||||
| External Plating Total: | 0.001770 | 1000000 | 24151.71875 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000683 | 1000000 | 9317.83007812 | ||||
| Internal Plating Total: | 0.000683 | 1000000 | 9317.83007812 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001109 | 750000 | 15129.5351562 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000370 | 250000 | 5047.72607422 | |||||
| Die Attach Total: | 0.001479 | 1000000 | 20177.2617188 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006015 | 150000 | 82059.6484375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.032882 | 820000 | 448592.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001003 | 25000 | 13683.4296875 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000201 | 5000 | 2742.14306641 | ||||
| Encapsulation Total: | 0.040101 | 1000000 | 547078 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000373 | 1000000 | 5088.65332031 | ||
| TOTAL MASS (g): | 0.073300 | |||||||