LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3828EG#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 18:21:43) | TOTAL MASS (g): | 0.232977 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004859 | 1000000 | 20856.140625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.122431 | 975000 | 525507 | ||
| Iron (Fe) | 7439-89-6 | 0.003014 | 24000 | 12936.9023438 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000038 | 300 | 163.106262207 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000088 | 700 | 377.719787598 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.125571 | 1000000 | 538984.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003749 | 1000000 | 16091.4287109 | ||||
| External Plating Total: | 0.003749 | 1000000 | 16091.4287109 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001005 | 1000000 | 4313.73144531 | ||||
| Internal Plating Total: | 0.001005 | 1000000 | 4313.73144531 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001269 | 750000 | 5446.890625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000423 | 250000 | 1815.63024902 | |||||
| Die Attach Total: | 0.001692 | 1000000 | 7262.52099609 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.009848 | 103000 | 42270.2773438 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085571 | 895000 | 367293.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 819.823608398 | ||||
| Encapsulation Total: | 0.095610 | 1000000 | 410383.96875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000491 | 1000000 | 2107.50463867 | ||
| TOTAL MASS (g): | 0.232977 | |||||||