LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3823EGN#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 04:04:21) | TOTAL MASS (g): | 0.172138 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004453 | 1000000 | 25868.7890625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.064009 | 975000 | 371847.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.001576 | 24000 | 9155.44726562 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000020 | 300 | 116.185882568 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000046 | 700 | 267.22756958 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.065651 | 1000000 | 381385.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003749 | 1000000 | 21778.6464844 | ||||
| External Plating Total: | 0.003749 | 1000000 | 21778.6464844 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000525 | 1000000 | 3049.87939453 | ||||
| Internal Plating Total: | 0.000525 | 1000000 | 3049.87939453 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001195 | 750000 | 6942.10693359 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000398 | 250000 | 2312.09912109 | |||||
| Die Attach Total: | 0.001593 | 1000000 | 9254.20605469 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb Free | Resin (EP) | 0.009848 | 103000 | 57209.9257812 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085571 | 895000 | 497107.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 1109.57531738 | ||||
| Encapsulation Total: | 0.095610 | 1000000 | 555426.6875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000557 | 1000000 | 3235.77685547 | ||
| TOTAL MASS (g): | 0.172138 | |||||||