LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3783IFE#PBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 04:17:58) | TOTAL MASS (g): | 0.059798 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003815 | 1000000 | 63797.9492188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.018525 | 975000 | 309792.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.000456 | 24000 | 7625.65283203 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 100.337547302 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000013 | 700 | 217.398010254 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.019000 | 1000000 | 317735.53125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002537 | 1000000 | 42428.6601562 | ||||
| External Plating Total: | 0.002537 | 1000000 | 42428.6601562 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000250 | 1000000 | 4180.73095703 | ||||
| Internal Plating Total: | 0.000250 | 1000000 | 4180.73095703 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001078 | 750000 | 18027.3085938 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000359 | 250000 | 6003.52929688 | |||||
| Die Attach Total: | 0.001437 | 1000000 | 24030.8398438 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004875 | 150000 | 81524.25 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.026650 | 820000 | 445665.90625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000813 | 25000 | 13595.7363281 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000163 | 5000 | 2725.83666992 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 543511.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000258 | 1000000 | 4314.51367188 | ||
| TOTAL MASS (g): | 0.059798 | |||||||