LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3772BEDDB#TRPBF | (Engineering Calculation) | DFN 3mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-17 03:38:44) | TOTAL MASS (g): | 0.013799 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000583 | 1000000 | 42250.6445312 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004212 | 975000 | 305248.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000104 | 24000 | 7536.99267578 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 72.4710845947 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000003 | 700 | 217.413269043 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.004320 | 1000000 | 313075.0625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000185 | 1000000 | 13378.6328125 | ||||
| External Plating Total: | 0.000185 | 1000000 | 13378.6328125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1000000 | 7464.52148438 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 7464.52148438 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000468 | 750000 | 33916.46875 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000156 | 250000 | 11305.4882812 | |||||
| Die Attach Total: | 0.000624 | 1000000 | 45221.953125 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.000875 | 110000 | 63412.203125 | |||
| Bromine (Br) | 40039-93-8 | 0.000080 | 10000 | 5797.68652344 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006758 | 850000 | 489759.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000239 | 30000 | 17320.5898438 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.007952 | 1000000 | 576290.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 2319.07470703 | ||
| TOTAL MASS (g): | 0.013799 | |||||||