LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3769HUF#PBF | (Engineering Calculation) | QFN 4mm X 4mm Exp. Pad | ||||||
| (printed on: 2017-03-17 03:39:25) | TOTAL MASS (g): | 0.040186 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001482 | 1000000 | 36878.9648438 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.015961 | 975000 | 397183 | ||
| Iron (Fe) | 7439-89-6 | 0.000393 | 24000 | 9779.64550781 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000005 | 300 | 124.422966003 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000011 | 700 | 273.730529785 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.016370 | 1000000 | 407360.78125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000773 | 1000000 | 19223.5253906 | ||||
| External Plating Total: | 0.000773 | 1000000 | 19223.5253906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000362 | 1000000 | 9008.22265625 | ||||
| Internal Plating Total: | 0.000362 | 1000000 | 9008.22265625 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000738 | 750000 | 18364.8300781 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000246 | 250000 | 6121.61035156 | |||||
| Die Attach Total: | 0.000984 | 1000000 | 24486.4414062 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002616 | 130000 | 65098.09375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.017303 | 860000 | 430578.09375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000201 | 10000 | 5001.80322266 | ||||
| Encapsulation Total: | 0.020120 | 1000000 | 500678 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000095 | 1000000 | 2364.03637695 | ||
| TOTAL MASS (g): | 0.040186 | |||||||