LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3766HGN#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 03:54:39) | TOTAL MASS (g): | 0.174012 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005636 | 1000000 | 32388.5820312 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.063999 | 975000 | 367785.0625 | ||
| Iron (Fe) | 7439-89-6 | 0.001575 | 24000 | 9051.10351562 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000020 | 300 | 114.934638977 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000046 | 700 | 264.34967041 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.065640 | 1000000 | 377215.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003749 | 1000000 | 21544.1035156 | ||||
| External Plating Total: | 0.003749 | 1000000 | 21544.1035156 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000525 | 1000000 | 3017.03417969 | ||||
| Internal Plating Total: | 0.000525 | 1000000 | 3017.03417969 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001433 | 750000 | 8235.06640625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000478 | 250000 | 2746.93774414 | |||||
| Die Attach Total: | 0.001911 | 1000000 | 10982.0048828 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.009848 | 103000 | 56593.8125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085571 | 895000 | 491753.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 1097.62585449 | ||||
| Encapsulation Total: | 0.095610 | 1000000 | 549445.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000941 | 1000000 | 5407.67480469 | ||
| TOTAL MASS (g): | 0.174012 | |||||||