LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3676ILXE-1#PBF | (Engineering Calculation) | eLQFP 7mm X 7mm Exp. Pad | ||||||
| (printed on: 2017-03-17 00:15:11) | TOTAL MASS (g): | 0.143327 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007391 | 1000000 | 51567.4375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.048877 | 975000 | 341017.6875 | ||
| Iron (Fe) | 7439-89-6 | 0.001203 | 24000 | 8393.40136719 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000015 | 300 | 104.65587616 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000035 | 700 | 244.197052002 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.050130 | 1000000 | 349759.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005224 | 1000000 | 36447.390625 | ||||
| External Plating Total: | 0.005224 | 1000000 | 36447.390625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000520 | 1000000 | 3628.07055664 | ||||
| Internal Plating Total: | 0.000520 | 1000000 | 3628.07055664 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001725 | 750000 | 12035.4257812 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000575 | 250000 | 4011.80834961 | |||||
| Die Attach Total: | 0.002300 | 1000000 | 16047.2333984 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.007929 | 103000 | 55321.0976562 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.068897 | 895000 | 480698.40625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000154 | 2000 | 1074.46691895 | ||||
| Encapsulation Total: | 0.076980 | 1000000 | 537094 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000782 | 1000000 | 5456.05957031 | ||
| TOTAL MASS (g): | 0.143327 | |||||||