LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3621IDCB-2#TRPBF | (Engineering Calculation) | DFN 2mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-16 18:30:22) | TOTAL MASS (g): | 0.015065 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000895 | 1000000 | 59407.875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.005723 | 975000 | 379878.53125 | ||
| Iron (Fe) | 7439-89-6 | 0.000141 | 24000 | 9359.22949219 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000002 | 300 | 132.755020142 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 700 | 265.510040283 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.005870 | 1000000 | 389636 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000260 | 1000000 | 17280.8886719 | ||||
| External Plating Total: | 0.000260 | 1000000 | 17280.8886719 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000136 | 1000000 | 9027.34277344 | ||||
| Internal Plating Total: | 0.000136 | 1000000 | 9027.34277344 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000216 | 800000 | 14337.5419922 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000054 | 200000 | 3584.38549805 | |||||
| Die Attach Total: | 0.000270 | 1000000 | 17921.9277344 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000989 | 130000 | 65647.359375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006545 | 860000 | 434440.78125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000076 | 10000 | 5044.69091797 | ||||
| Encapsulation Total: | 0.007610 | 1000000 | 505132.84375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000024 | 1000000 | 1593.06030273 | ||
| TOTAL MASS (g): | 0.015065 | |||||||