LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC3615EUF-1#TRPBF (Engineering Calculation) QFN 4mm X 4mm Exp. Pad  
(printed on: 2017-03-17 01:20:29) TOTAL MASS (g): 0.041519
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002376 1000000 57227.4921875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.015961 975000 384431
Iron (Fe) 7439-89-6 0.000393 24000 9465.65820312
Phosphorus (P) 7723-14-0 0.000005 300 120.428222656
Zinc (Zn) 7440-66-6 0.000011 700 264.942108154
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.016370 1000000 394282
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000773 1000000 18606.3339844
External Plating Total: 0.000773 1000000 18606.3339844
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000362 1000000 8719.00390625
Internal Plating Total: 0.000362 1000000 8719.00390625
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001018 750000 24519.1855469
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000339 250000 8165.03369141
Die Attach Total: 0.001357 1000000 32684.21875
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.002616 130000 63008.046875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.017303 860000 416753.875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000201 10000 4841.21484375
Encapsulation Total: 0.020120 1000000 484603.1875
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000161 1000000 3877.7890625
  TOTAL MASS (g): 0.041519