LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3610EWP#TRPBF | (Engineering Calculation) | QFN MultiPad 9 X 9 X 0.9 mm | ||||||
| (printed on: 2017-03-17 03:47:08) | TOTAL MASS (g): | 0.269546 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002566 | 1000000 | 9519.70117188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.104491 | 975000 | 387655.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.002572 | 24000 | 9541.9609375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000032 | 300 | 118.718025208 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000075 | 700 | 278.245361328 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.107170 | 1000000 | 397594.0625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003192 | 1000000 | 11843.1328125 | ||||
| External Plating Total: | 0.003192 | 1000000 | 11843.1328125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002279 | 1000000 | 8454.94824219 | ||||
| Internal Plating Total: | 0.002279 | 1000000 | 8454.94824219 | |||||
| Die Attach | 95 Sn / 5 Sb | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.001805 | 950000 | 6696.43847656 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000095 | 50000 | 352.444122314 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001900 | 1000000 | 7048.88232422 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.019486 | 130000 | 72291.859375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.128910 | 860000 | 478248.15625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001499 | 10000 | 5561.19726562 | ||||
| Encapsulation Total: | 0.149895 | 1000000 | 556101.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.002544 | 1000000 | 9438.08300781 | ||
| TOTAL MASS (g): | 0.269546 | |||||||