LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC3608EWKG#TRPBF (Engineering Calculation) QFN MultiPad 7 X 8 X 0.9 mm  
(printed on: 2017-03-17 03:37:32) TOTAL MASS (g): 0.159795
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002566 1000000 16058.0410156
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.076937 975000 481472.125
Iron (Fe) 7439-89-6 0.001894 24000 11852.6621094
Phosphorus (P) 7723-14-0 0.000024 300 150.192138672
Zinc (Zn) 7440-66-6 0.000055 700 344.1902771
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.078910 1000000 493819.21875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.003848 1000000 24082.9023438
External Plating Total: 0.003848 1000000 24082.9023438
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.001694 1000000 10601.0605469
Internal Plating Total: 0.001694 1000000 10601.0605469
Die Attach 95Sn / 5Sb Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.001805 950000 11295.6992188
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000095 50000 594.510498047
Resin (EP)   0.000000 0 0
Die Attach Total: 0.001900 1000000 11890.2099609
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.008945 130000 55977.859375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.059177 860000 370329.96875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000688 10000 4305.50732422
Encapsulation Total: 0.068810 1000000 430613.34375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.002067 1000000 12935.296875
  TOTAL MASS (g): 0.159795