LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC3577EUFF#TRPBF | (Engineering Calculation) | QFN 4mm X 7mm Exp. Pad | ||||||
| (printed on: 2017-03-16 21:27:05) | TOTAL MASS (g): | 0.07242 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002487 | 1000000 | 34341.4960938 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.032024 | 975000 | 442200.25 | ||
| Iron (Fe) | 7439-89-6 | 0.000788 | 24000 | 10881.0195312 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000010 | 300 | 138.084014893 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000023 | 700 | 317.593231201 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.032845 | 1000000 | 453536.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001569 | 1000000 | 21660.9882812 | ||||
| External Plating Total: | 0.001569 | 1000000 | 21660.9882812 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000718 | 1000000 | 9914.43164062 | ||||
| Internal Plating Total: | 0.000718 | 1000000 | 9914.43164062 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001061 | 750000 | 14650.7148438 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000354 | 250000 | 4888.17382812 | |||||
| Die Attach Total: | 0.001415 | 1000000 | 19538.8867188 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004302 | 130000 | 59403.7421875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.028457 | 860000 | 392945.6875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000331 | 10000 | 4570.58056641 | ||||
| Encapsulation Total: | 0.033090 | 1000000 | 456919.96875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000296 | 1000000 | 4087.28710938 | ||
| TOTAL MASS (g): | 0.072420 | |||||||