LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3552EDHC-1#PBF | (Engineering Calculation) | DFN 5mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-16 22:05:51) | TOTAL MASS (g): | 0.037745 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000774 | 1000000 | 20506.0273438 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.017072 | 975000 | 452298.3125 | ||
| Iron (Fe) | 7439-89-6 | 0.000420 | 24000 | 11127.3017578 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000005 | 300 | 132.467880249 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000012 | 700 | 317.922912598 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.017509 | 1000000 | 463876.03125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000817 | 1000000 | 21645.3066406 | ||||
| External Plating Total: | 0.000817 | 1000000 | 21645.3066406 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000391 | 1000000 | 10358.9882812 | ||||
| Internal Plating Total: | 0.000391 | 1000000 | 10358.9882812 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000493 | 750000 | 13061.3330078 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000164 | 250000 | 4344.94628906 | |||||
| Die Attach Total: | 0.000657 | 1000000 | 17406.2792969 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.001924 | 110000 | 50973.640625 | |||
| Bromine (Br) | 40039-93-8 | 0.000175 | 10000 | 4636.37548828 | ||||
| Silica (SiO2) | 60676-86-0 | 0.014866 | 850000 | 393853.5 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000525 | 30000 | 13909.1269531 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.017490 | 1000000 | 463372.65625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000107 | 1000000 | 2834.81274414 | ||
| TOTAL MASS (g): | 0.037745 | |||||||