LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC3547EDDB-1#TRPBF | (Engineering Calculation) | DFN 3mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-17 04:11:41) | TOTAL MASS (g): | 0.013812 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000590 | 1000000 | 42717.6992188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004212 | 975000 | 304960.90625 | ||
| Iron (Fe) | 7439-89-6 | 0.000104 | 24000 | 7529.89892578 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 72.4028778076 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000003 | 700 | 217.208633423 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.004320 | 1000000 | 312780.40625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000185 | 1000000 | 13366.0419922 | ||||
| External Plating Total: | 0.000185 | 1000000 | 13366.0419922 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1000000 | 7457.49609375 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 7457.49609375 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000473 | 750000 | 34246.5585938 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000158 | 250000 | 11439.6542969 | |||||
| Die Attach Total: | 0.000631 | 1000000 | 45686.2109375 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001034 | 130000 | 74864.5703125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006837 | 860000 | 495018.46875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000080 | 10000 | 5792.22998047 | ||||
| Encapsulation Total: | 0.007951 | 1000000 | 575675.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 2316.89208984 | ||
| TOTAL MASS (g): | 0.013812 | |||||||