LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3410ESC6-1.8#PBF | (Engineering Calculation) | SC70 | ||||||
| (printed on: 2017-03-17 04:00:08) | TOTAL MASS (g): | 0.010411 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000483 | 1000000 | 46392.7070312 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.003442 | 975000 | 330608.03125 | ||
| Iron (Fe) | 7439-89-6 | 0.000085 | 24000 | 8164.34716797 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 96.0511474609 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000002 | 700 | 192.102294922 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.003530 | 1000000 | 339060.53125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003408 | 1000000 | 327353.8125 | ||||
| External Plating Total: | 0.003408 | 1000000 | 327353.8125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000023 | 1000000 | 2209.17626953 | ||||
| Internal Plating Total: | 0.000023 | 1000000 | 2209.17626953 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000281 | 750000 | 26990.3710938 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000094 | 250000 | 9028.80859375 | |||||
| Die Attach Total: | 0.000375 | 1000000 | 36019.1796875 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000147 | 58000 | 14119.5175781 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.002261 | 890000 | 217171.640625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000127 | 50000 | 12198.4960938 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000005 | 2000 | 480.255737305 | ||||
| Encapsulation Total: | 0.002540 | 1000000 | 243969.921875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000052 | 1000000 | 4994.65966797 | ||
| TOTAL MASS (g): | 0.010411 | |||||||