LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC3407EDD-2#PBF | (Engineering Calculation) | DFN 3mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 04:00:43) | TOTAL MASS (g): | 0.02337 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001288 | 1000000 | 55112.5351562 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.009711 | 975000 | 415526.3125 | ||
| Iron (Fe) | 7439-89-6 | 0.000239 | 24000 | 10226.6279297 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 128.367706299 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 299.524658203 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.009960 | 1000000 | 426180.8125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000455 | 1000000 | 19484.6230469 | ||||
| External Plating Total: | 0.000455 | 1000000 | 19484.6230469 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000225 | 1000000 | 9627.578125 | ||||
| Internal Plating Total: | 0.000225 | 1000000 | 9627.578125 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000671 | 750000 | 28711.578125 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000224 | 250000 | 9584.7890625 | |||||
| Die Attach Total: | 0.000895 | 1000000 | 38296.3671875 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001362 | 130000 | 58278.9414062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.009013 | 860000 | 385659.40625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000105 | 10000 | 4492.87011719 | ||||
| Encapsulation Total: | 0.010480 | 1000000 | 448431.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000067 | 1000000 | 2866.87890625 | ||
| TOTAL MASS (g): | 0.023370 | |||||||