LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC3124HFE#PBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 16:16:43) | TOTAL MASS (g): | 0.059891 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003723 | 1000000 | 62162.765625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.018525 | 975000 | 309311.125 | ||
| Iron (Fe) | 7439-89-6 | 0.000456 | 24000 | 7613.81201172 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 100.181739807 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000013 | 700 | 217.060424805 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.019000 | 1000000 | 317242.15625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002537 | 1000000 | 42362.78125 | ||||
| External Plating Total: | 0.002537 | 1000000 | 42362.78125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000250 | 1000000 | 4174.23876953 | ||||
| Internal Plating Total: | 0.000250 | 1000000 | 4174.23876953 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001082 | 750000 | 18066.1054688 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000361 | 250000 | 6027.60107422 | |||||
| Die Attach Total: | 0.001443 | 1000000 | 24093.7089844 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004875 | 150000 | 81397.65625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.026650 | 820000 | 444973.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000813 | 25000 | 13574.625 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000163 | 5000 | 2721.60400391 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 542667.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000437 | 1000000 | 7296.56982422 | ||
| TOTAL MASS (g): | 0.059891 | |||||||